More information about Molded Bipolar Plates |
Selected raw materials for bipolar plates |
Material TechnologyMaterials allow a very high fuel cell performance. These materials are specially selected and qualified for fuel cells backed by 90 years of expertise with graphite and carbon materials. Continuous compound production permits utmost homogeneity and highest material quality. |
Manufacturing TechnologyWe apply low-cost molding processes for serial production of bipolar plates as well as CNC machining for manufaturing of prototype plates. Experienced in-house tool shop uses the most advanced equipment for mold manufacturing. We offer support to promote designs that are highly compatible with our molding process and our modular mold technology. |
Further Advantages of Bipolar PlatesProduct quality has been proven over the years for a wide range of fuel cell applications. Plates have an excellent electrical and thermal conductivity (as rated by our customers). |
Special hydrophilic or hydrophobic surface modificationsImprove the operational characteristics of bipolar plates without influencing their favorable electrical properties.
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Advanced Fuel Cell ComponentsSchunk Kohlenstofftechnik GmbH offers bipolar plates with directly integrated profiled seals. |
In a joint development effort Schunk Kohlenstofftechnik and Freudenberg Fuel Cell Component Technologies have integrated 3D-structured seals into molded plates Real application tests confirm that these 3D seals prevent leakage at relatively low contact pressure. |
Properties of grades for PEFC, DMFC and HT-PEFC |
FU 4369 |
FU 4369 HT |
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Application |
Standard grade for machined prototype and molded plates PEM/DMFC | Standard grade for machined prototype and molded plates HT - PEM | |
Physical PropertiesDensityWater absorption Minimum web thickness |
1.90 g · cm-3 0.15% 0.9 mm |
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Mechanical PropertiesHardness HRB10/40Bending strength Compressive strength |
100 40 MPa 50 MPa |
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Electrical PropertiesSpecific electrical resistance- in plane xy - through plane z |
90 µΩm 190 µΩm |
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Thermal PropertiesCoefficient of thermal expansion20 oC to 60 oC 20 oC to 100 oC 20 oC to 140 oC |
xy / z 7 / 20 · 10-6 K-1 11 / 28 · 10-6 K-1 15 / 38 · 10-6 K-1 |
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Thermal conductivity | 55 W / mK | ||
Heat deflection temperature Glass transition temperature |
190 oC 170 oC |
210 oC 190 oC |
FU 4413 which has been specially developed for thin plates is available on request. |
Long Term Stability |
Test performed:
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Further test results are available on request The data shown above are not guaranteed, but typical values based on our experience.It should be understood that a spread of results can occur due to variations in materials and production processes. |